峰會報告 | 應用光子技術解決Mini 和 Micro LED制程工藝技術難題

Time：2023-08-30

8月30日，炬光科技泛半導體制程事業(yè)部總經理戴曄應邀出席“第三屆國際Mini/Micro-LED供應鏈創(chuàng)新發(fā)展峰會（IMDS 2023）”，并作出了題為《應用光子技術解決Mini 和 Micro LED制程工藝技術難題》的主題演講。演講聚焦Mini/Micro LED的核心工藝技術，探索Mini/Micro LED供應鏈的創(chuàng)新機遇與解決難題挑戰(zhàn)的方案，期待共同推動Mini/Micro-LED技術的快速發(fā)展與量產商業(yè)化。

演講主題：《應用光子技術解決Mini/Micro LED制程工藝技術難題》

演講人：西安炬光科技股份有限公司?泛半導體制程事業(yè)部總經理?戴曄

與傳統(tǒng)的LCD和OLED相比，Mini LED和Micro LED展現出更高的對比度、寬廣的色域、長久的壽命以及更低的功耗等優(yōu)勢。然而，新技術也帶來了巨量焊接、芯片修復等制程挑戰(zhàn)。戴曄表示，光子技術為實現這些新型顯示技術提供了關鍵支持。在Mini LED制程中，激光巨量焊接技術通過使用光學整形后的光斑，加熱并連接LED芯片，有效提升了焊接效率，解決了傳統(tǒng)回流焊的問題。另外，光子技術還在Mini LED芯片修復方面發(fā)揮作用，通過激光修復系統(tǒng)對LED芯片進行精確修復，解決了芯片變色、位置移動等問題。

在Micro LED制程中，光子技術同樣扮演著關鍵角色。巨量轉移技術利用微納光學設計與模擬，實現高精度的光斑勻化輸出，為微小LED芯片的轉移提供技術支持。光子技術的模塊化設計，例如光束整形模塊，解決了制程中的均勻性和斜率等問題，確保制程的精準性和穩(wěn)定性。戴曄也希望可以和產業(yè)鏈多互動交流，共同建立行業(yè)標準，降低新技術產業(yè)化突破中的供應鏈瓶頸。

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峰會報告 | 應用光子技術解決Mini 和 Micro LED制程工藝技術難題

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